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Evaluating the effect of pad sizes on the inter-metallic layer formation and growth for Sn-Ag-Cu solders on Cu metallization

Paper Details
Authors:
Peter K. Bernasko
Sabuj Mallik
N.N. Ekere
G. Takyi
Publication Date: 2011-04-13
Electronic Packaging and Soldering TechnologiesEngineeringElectrical and Electronic EngineeringPhysical Sciences
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