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Numerical Investigation of Thermo-Mechanical Behaviour of Ball Grid Array Solder Joint at High Temperature Application

Paper Details
Authors:
Emeka H. Amalu
N.N. Ekere
Raj Bhatti
G. Takyi
Akii Okonigbon Akaehomen Ibhadode
Publication Date: 2010-01-01
Electronic Packaging and Soldering TechnologiesEngineeringElectrical and Electronic EngineeringPhysical Sciences
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