Back to Search

Effect of reflow profile and thermal cycle ageing on the intermetallic formation and growth in lead-free soldering

Paper Details
Authors:
Peter K. Bernasko
Sabuj Mallik
N.N. Ekere
Anasyida Abu Seman
G. Takyi
Publication Date: 2009-12-01
Electronic Packaging and Soldering TechnologiesEngineeringElectrical and Electronic EngineeringPhysical Sciences
Access Restricted

This paper is not available under open access. The publisher restricts full-text distribution.

You may still be able to access it through your institution, request it directly from the author, or view the abstract and citation details.

External Resources

Paper information is provided by public research databases. Summaries are generated to aid understanding and may not reflect the complete scope of the work. For the authoritative version, please refer to the original publication.